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MQX.NeVa-M

Built for Fine Detail. Designed to Catch What Others Miss.

MQX.NeVa-M systems are purpose-built for inspecting small, complex, and high-precision components where even the tiniest defect can lead to major failure.

JIMA resolution up to 0.5 µm160 kV – 300 kVCT · DR · Panoramic
MQS microfocus X-ray system with open frame, microfocus tube, rotary manipulator and flat panel detector
0.5 µm
JIMA resolution capability
160 – 300 kV
Nominal tube voltage
4
Tube types
Up to 20 years
System lifetime

From PCB solder joints to aerospace composites, our systems deliver micron-scale imaging clarity with configurable tube technologies and modular architecture tailored to your application—supporting DR, CT, and panoramic inspection workflows.

Key Benefits

01

Ultra-High Resolution Imaging

Detect micro-cracks, porosities, inclusions, and bonding issues—down to 0.5 μm capability for precision-critical components.

02

One Platform for Mixed Materials

Wide operating range (160–300 kV) supports inspection from thin PCBs to dense aerospace alloys without switching platforms.

03

Faster Scans, Higher Throughput

High-power tube options and efficient cooling reduce scan time while preserving image quality—ideal for production and QC labs.

04

Flexible Inspection Modes

Support CT, DR, and panoramic imaging to handle different part geometries and failure modes without additional machines.

05

Future-Ready Analytics

Designed for integration with advanced analysis tools (e.g., VGStudio MAX, CT reconstruction, and AI-ready defect workflows) for smarter decisions.

Solution Highlights

Open-frame MQS microfocus X-ray system with numbered callouts on the tube, manipulator, detector and frame

Technical Data

Transmission Tube

  • High resolution applications in electronic, automotive, aviation semiconductor industry, material science and space industries
  • Down to 1 micron detail detectability and down to 0.2 micron high resolution target for computed tomography (CT) applications
  • Single or double stage electron optics with condenser, centering and focusing coils
  • Unsurpassed target power with target cooling and High Energy Target to reduce scanning time for computed tomography (CT) or Computed Laminography (CL) applications

Product line

Max. voltage

Configuration
Transmission · THE · 225 kV
Min. voltage
20 kV
Current
0.05 – 1 mA
Max. power, target
10 W
Max. power, emission
80 W
JIMA resolution
2 µm
Target material
Beryllium / Tungsten
Min. FOD
0.25 mm
Opening angle
≈160°
Tube weight
≈51 kg

Values from the MQMF brochure.

04

Flexible Inspection Modes

Support CT, DR, and panoramic imaging to handle different part geometries and failure modes without additional machines.

Digital Radiography

DR

Computed Tomography

CT

Rod Anode Tube

Panoramic

Applications

PCB solder jointsAerospace compositesMicro-cracksPorositiesInclusionsBonding issues
Get in touch

Tell us what you need to inspect

Share your part, material and defect type — our engineers will recommend the right MQS system.