See hidden solder defects
Reveal BGA and QFN voids, cracks, bridging and head-in-pillow conditions that visual inspection can miss.
Electronics & semiconductors
Custom requirements. Engineered solution.
See Inside the Board. Stop Defects Before They Travel.
From SMT production to failure analysis, MQS X-ray and CT solutions reveal hidden solder, package and interconnect defects without damaging the assembly.
Talk to an ExpertIndustry overview
Smaller Packages. Denser Boards. Less Room for Uncertainty.
Electronics manufacturing is moving toward higher density, finer-pitch packages, multilayer assemblies and faster production cycles.
Defects such as voiding, bridging, head in pillow, lifted leads and insufficient solder fill can remain invisible to visual inspection and surface later as rework, yield loss or field failure. X-ray and CT reveal those internal connections without cutting the board.
What electronics QA teams need
Inspection evidence that keeps production moving.
Resolve overlap
Separate layered boards and stacked features when a single 2D view leaves internal structures ambiguous.
Keep pace with production
Support fast, repeatable decisions without turning inspection into a production queue.
Reduce destructive analysis
Build internal evidence before cutting a board or introducing additional rework risk.
Standardize decisions
Use measurement, pass/fail criteria and repeatable workflows to reduce operator subjectivity.
Protect inventory flow
Count reel components accurately to prevent material mismatch and line stoppages.
Create traceability
Retain inspection images, measurements and reports for process analysis, customer review and audits.
Application engineering
Your Board Defines the Inspection.
MQS starts with the board, package and defect target, then selects or configures the imaging chain, handling, automation and software needed to answer it.
Board & package
PCB size, package type and density
Inspection goal
Defect type, resolution and evidence
Imaging mode
2D, 2.5D, CT or inline 3D
Automation & data
Handling, reporting and ERP / SPC
Engineered solution
Standard platform or configured system
Built for production. Built for analysis.
Use the right depth of answer at the right stage.
Production screening, root-cause analysis, process control and material planning ask different questions.
Fast 2.5D screening
Inspect solder joints quickly, with oblique views when straight 2D imaging is not enough.
3D CT slicing
Separate overlapping features and inspect internal layers without destructive sectioning.
Inline 2D / 2.5D / 3D
Inspect within the production flow with automated defect analysis and board handling.
Measurement & reporting
Apply measurement tools, pass/fail support and evidence-ready reporting.
Traceability & integration
Retain results and connect inspection data to production systems where configured.
AI component counting
Count components on reels quickly to support material planning and inventory accuracy.
Inspection concerns
See the defects that matter.
BGA / QFN voiding
Internal void pattern, size and distribution within solder or die-attach regions.
Head in pillow & bridging
Connection anomalies hidden beneath packages.
PTH fill
Barrel fill and void percentage for through-hole solder joints.
Bond wires & die attach
Internal package features, bond-wire condition and die-attach voiding.
Layer overlap
CT slices that separate stacked features and reveal the true internal structure.
Cracks / delamination
Internal discontinuities that may not be visible from the surface.
Inventory mismatch
X-ray-based component counting for reel inventory and planning.
MQS electronics portfolio
One electronics line. Different inspection questions.
Move from fast screening to CT analysis, inline automation and inventory control using the platform matched to the question.
AI component counting
MQX.gINti
Fast, accurate SMT reel counts that support inventory planning and reduce material-related line stoppages.
2.5D PCB X-ray inspection
MQX.tracE
Fast inspection of BGA, QFN, PTH and common SMT defect conditions without damaging the assembly.
2D screening with 3D CT
MQX.tracE CT
Layer-by-layer analysis, root-cause confirmation and traceable reporting when overlap creates ambiguity.
Inline 2D / 2.5D / 3D
MQX.tracE | IN-3D
Automated inspection and board handling inside the production flow rather than at an offline station.
Fine-detail X-ray / CT
MQX.NeVa-M
Finer internal detail for package analysis, R&D and failure investigation beyond routine board screening.
Inspection evidence
See the evidence, not just the part.
Indigenous engineering
Proven Platforms. Configured for Your Process.
Standard where it works. Custom where it matters.
MQS starts with a proven inspection platform, then adapts imaging, handling, automation, analysis, reporting and integration where the process requires it. Design ownership and long-term engineering support let the system evolve with the production line.
Resources
Technical details for your review.
Move directly from the inspection question to the relevant platform information.
PDF brochureMQX.tracE2.5D PCB X-ray inspection brochurePDF brochureMQX.tracE CT3D CT inspection brochurePDF brochureMQX.tracE | IN-3DInline 2D / 2.5D / 3D inspection flyerPDF brochureMQX.NeVa-MFine-detail X-ray / CT brochurePDF brochureMQX.gINtiAI X-ray component counter flyer
Bring us the board. We’ll engineer the inspection.
Share the package, defect target, throughput requirement and traceability need.